http://dspace.bsu.edu.ru/handle/123456789/62904| Title: | Molecular dynamics simulation of diffusion along general high-angle grain boundaries in copper and vanadium |
| Authors: | Vyazmin, A. V. Lipnitskii, A. G. Maksimenko, V. N. Poletaev, D. O. Kartamyshev, A. I. |
| Keywords: | technique metal science grain boundaries diffusion molecular dynamics copper vanadium |
| Issue Date: | 2023 |
| Citation: | Molecular dynamics simulation of diffusion along general high-angle grain boundaries in copper and vanadium / A.V. Vyazmin, A.G. Lipnitskii, V.N. Maksimenko [et al.] // Letters on Materials. - 2023. - Vol.13, №4s.-P. 450-455. |
| Abstract: | In this paper, atomistic simulations were used to calculate the characteristics of grain boundary diffusion, estimation of which from the results of experimental studies is limited. The proposed approach is illustrated on the example of molecular dynamics simulations of general high-angle grain boundaries in copper and vanadium |
| URI: | http://dspace.bsu.edu.ru/handle/123456789/62904 |
| Appears in Collections: | Статьи из периодических изданий и сборников (на иностранных языках) = Articles from periodicals and collections (in foreign languages) |
| File | Description | Size | Format | |
|---|---|---|---|---|
| Lipnitskiy_Molecular dynamics_23.pdf | 133.64 kB | Adobe PDF | View/Open |
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