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Please use this identifier to cite or link to this item: http://dspace.bsu.edu.ru/handle/123456789/42728
Title: Role of alternating current shape on microstructure and damage evolution of solder joints
Authors: Waluyo Adi Siswanto
Krasnopevtsev, A. Yu.
Ghazal Feizi Talarpoushti
Andino Maseleno
Kuzichkin, O. R.
Keywords: physics
electricity
solder joint
AC current
degradation
mechanical properties
electric current
electronic packages
Issue Date: 2020
Citation: Role of alternating current shape on microstructure and damage evolution of solder joints / Waluyo Adi Siswanto [et al.] // Journal of Manufacturing Processes. - 2020. - Vol.50.-P. 450-455. - Doi: 10.1016/j.jmapro.2019.12.041. - Refer.: p. 454-455.
Abstract: Thermal resistivity of solder joints was considered as failure indicator and found that the triangle AC current had the significant effect on the increase of thermal resistivity in the solder joint in a certain time compared with other AC current shapes
URI: http://dspace.bsu.edu.ru/handle/123456789/42728
Appears in Collections:Статьи из периодических изданий и сборников (на иностранных языках) = Articles from periodicals and collections (in foreign languages)

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