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Please use this identifier to cite or link to this item: http://dspace.bsu.edu.ru/handle/123456789/15688
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dc.contributor.authorLopatin, N.-
dc.contributor.authorSenkevich, K.-
dc.contributor.authorKudryavtsev, E.-
dc.date.accessioned2016-04-21T08:03:31Z-
dc.date.available2016-04-21T08:03:31Z-
dc.date.issued2014-
dc.identifier.citationLopatin, N. Effect of microstructure state of titanium alloy Ti-6Al-4V on structure and mechanical properties of joints produced by diffusion bonding process / N. Lopatin, K. Senkevich, E. Kudryavtsev // Materials Science Forum. - 2014. - Vol. 783-786.-P. 2659-2664. - doi: 10.4028/www.scientific.net/MSF.783-786.2659.ru
dc.identifier.urihttp://dspace.bsu.edu.ru/handle/123456789/15688-
dc.description.abstractThe studies of diffusion bonded samples of Ti-6Al-4V and Nitinol alloys were carried out considering the titanium alloy in two states: ultra-fine grained and bi-modal microstructures, the last one consisted of small and large a-phase grains. Depending on microstructure and chemical composition of the alloys, the diffusion bonding had been made at temperatures from 600°C to 850°C. The microstructures of joints was studied by scanning electron microscope using detector of backscattering electron diffraction. The shear strengths of joints were measured. It was concluded that the ultra-fine grained Ti-6Al-4V alloy could be applied for joints manufactured at a temperature lower than 750°C. The bi-modal Ti-6Al-4V alloy is an effective material for producing the joints at the temperature larger that 750°Cru
dc.language.isoenru
dc.subjecttechniqueru
dc.subjectmetal scienceru
dc.subjectalloysru
dc.subjecttitanium alloyru
dc.subjectultra-fine grainedru
dc.subjectultra-fine grained Ti-6Al-4Vru
dc.subjectmicrocrystalline Ti-6Al-4Vru
dc.subjectnitinolru
dc.subjectdiffusion bondingru
dc.subjectmicrostructureru
dc.subjectshear strengthru
dc.subjectmechanical propertiesru
dc.titleEffect of microstructure state of titanium alloy Ti-6Al-4V on structure and mechanical properties of joints produced by diffusion bonding processru
dc.typeArticleru
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